Delivery capability
类别 Category
样板加工 Sample processing
批量生产 Volume production
层数
Layer count
1-64L
1-46L
成品板厚
Board thickness
0.2mm - 10.0mm
0.4mm - 6.0mm
最大加工面积
Max manufacturing size
610mm * 1200mm
610mm * 1200mm
成品铜厚
Copper foil thinckness
0.5OZ - 12OZ
0.5OZ - 6OZ
最小线宽/间距
Min line whith/space
2.5mil / 2.5mil
3mil / 3mil
最小成品孔径
Min finish hole size
0.1mm
0.15mm
可加工最大厚径比
aspect ratio
25:1
12:1
阻抗控制
Impedace control
+/-10%
+/-10%
表面处理： 有铅/无铅喷锡、化学沉金、化学沉锡、化学沉银、插头镀金、全板镀金、防氧化、镍钯金、局部镀金
常用板料： FR4Tg150 ℃/Tg170 ℃，Rogers，arlon，Taconic，Bergquist，TU-872SKL，TU-883，Panasonic M6/M7
特殊工艺： 埋盲孔，盘中孔，板边金属化，半孔，台阶安装孔，控深钻孔，金属基(芯)板，阶梯金手指，背钻，局部混压高频板，母排，嵌铜块，嵌陶瓷
Surface treatment: HASL leaded/HASL lead free, lmmersion gold, lmmersion Tin, lmmersion Silver. Gold Finger, Flash Gold, OSP, ENEPIG and Selective hard gold plating.
Materials: FR4Tg150℃/Tg170℃, Rogers,Arlon,Taconic,Bergquist,TU-872SLK,TU-883,Panasonic M6/M7 and so on
Special technology : Blind & buried holes, Via in pad, Semi-plating holes, Counterbore, Step mounting holes, drill Mixed RF PCB,Busbar PCB